http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08120161-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
filingDate 1994-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5659f45c52256adcc96b808d975dfc6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_449260fed16619c8990000dc20b33945
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publicationDate 1996-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H08120161-A
titleOfInvention Epoxy resin composition for laminated board and method for producing the same
abstract (57) [Summary] [PROBLEMS] To provide an epoxy resin composition for a laminated board and a method for producing the same, which can obtain a cured product having excellent moisture resistance and which can produce a laminated plate with less defective board thickness and less scratches. A laminate epoxy resin composition containing an epoxy resin, a phenol novolac, an aromatic amine, a curing accelerator, and an organic solvent, which is 0.8 to 0. 95 phenolic hydroxyl group equivalent phenol novolac and 0.05 to 0.2 active hydrogen equivalent aromatic amine. A mixture of epoxy resin compositions for laminates containing a part or all of the epoxy resin, an aromatic amine and an organic solvent is mixed, and the active hydrogen of the aromatic amine is relative to the total active hydrogen of the aromatic amine. 50 to 100% of the above is reacted with an epoxy resin, and phenol novolac, a curing accelerator, and the remaining epoxy resin are post-added and mixed.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6649729-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9929757-A1
priorityDate 1994-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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