| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
| filingDate |
1994-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_227805b3d18f8c4eac9611e2600807c5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d848d1a24b97a2955430036a13e9a8e6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b38aeb2a199590caf1f2e8108c4f576e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a6b5e90cc4a6b5cd4befa93b10597a5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1db7d1b2d5c754e4c7eeaec5aefc220 |
| publicationDate |
1996-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H08120054-A |
| titleOfInvention |
Epoxy resin composition for encapsulation and semiconductor device |
| abstract |
(57) [Summary] [Purpose] An epoxy resin composition for encapsulation which gives a cured product having good release property and adhesiveness while maintaining low stress and thermal shock resistance using the composition are improved. Provided is a semiconductor device. [Structure] An epoxy resin composition for encapsulation obtained by adding a polyolefin wax has two or more vinyl groups directly bonded to a silicon atom in one molecule, and has a degree of polymerization of 50 to 50. It has 500 organopolysiloxanes and two or more hydrogen atoms directly bonded to silicon atoms in one molecule, and has a degree of polymerization of 10 To 200 organopolysiloxane and a polyoxyalkylene group-containing organopolysiloxane are reacted in an epoxy resin or a phenol novolac resin to contain a silicone-modified epoxy resin or a silicone-modified phenol novolac resin. In addition, the semiconductor device A semiconductor element is sealed using the above-mentioned sealing epoxy resin composition. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015079887-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006049156-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015179814-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101254524-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006182913-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101235075-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015048423-A |
| priorityDate |
1994-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |