http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08112851-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_26c536340aa6d174929c588553cce1db
classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K105-04
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C48-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C48-90
filingDate 1994-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_233a0876b5eee3454fb8f97676ec169e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5beb28b906f7bf4e9d52c02e416487d7
publicationDate 1996-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H08112851-A
titleOfInvention Method for producing low-foaming crystalline resin molding
abstract (57) [Summary] [Object] To provide a manufacturing method which does not cause voids inside a molded article when a crystalline resin is extrusion-molded. [Composition] The resin discharge port of the extrusion die is a slit-shaped discharge port on the front surface that mainly forms the surface skin layer and the foam layer inside the molded product, and a slit-shaped discharge port on the back surface that mainly forms the back skin layer and the foam layer inside the molded product. The sum of the slit widths of the front surface slit-shaped outlet and the back surface slit-shaped outlet is 20% to 90% of the thickness of the molded body, and the extruder-side tip surface of the sizing die is a resin of the extrusion die. It is positioned close to the discharge surface and extrusion molding is performed.
priorityDate 1994-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 17.