Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
filingDate |
1994-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b4e32d119a94e447533b9755dafacaa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9086f549d9094c6378b92f2cfc10eed8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5f8468d5dacb2a00aa3af0b2d021ee45 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98678deb7fd08d57628a6fe4ba20cb59 |
publicationDate |
1996-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-H08104796-A |
titleOfInvention |
Semiconductor encapsulating resin composition and semiconductor device encapsulated with the composition |
abstract |
(57) [Summary] [Purpose] Excellent in workability in molding and thermal expansion coefficient of LSI Provided is a resin composition for semiconductor encapsulation which is as small as an element. [Structure] The resin composition for semiconductor encapsulation has an average particle size of 3 to 5 To the fused spherical silica (A) of 0 μm, the spherical silica (B) having a particle diameter of 1/10 to 1/100 of this fused spherical silica is The silica-based filler adhered so that the ratio of (A + B) is 1 to 9% by weight is 75% with respect to the total weight of the resin composition. ˜90% by weight. [Effect] The fine-grained spherical silica B functions as a roller to reduce the dilatant property, and lowers the viscosity of the resin composition during transfer molding of the resin composition. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9387608-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002294029-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014195106-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006143784-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10381533-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018129477-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018147006-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023120740-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015096611-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011057734-A |
priorityDate |
1994-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |