http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0790081-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3f548ca15b9b5748f1afd80e3d1636ec |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 |
| filingDate | 1993-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2bf567b064206f661534822d26c18377 |
| publicationDate | 1995-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0790081-A |
| titleOfInvention | Polyimide resin |
| abstract | (57) [Summary] The polyimide resin composition of the present invention comprises a diphenyl ether tetracarboxylic acid component as an acid component of 50 mol% or more of the polyimide resin and an aromatic ether diamine as 50 mol% or more of a diamine component. , Is configured. [Effect] According to the present invention, since the polyimide resin is composed of the specific acid component / diamine component, it is possible to cure at a temperature of 200 ° C. or lower. The cured product has heat resistance and electrical characteristics equivalent to those of conventional polyimide resins. Therefore, in the semiconductor device, the element protection film, the wiring interlayer insulating film, F It is suitable not only for PC substrates but also for junction coating of various discrete products. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010189510-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010132725-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4575725-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006060048-A |
| priorityDate | 1993-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 59.