http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0789780-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B41-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B41-009
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B41-89
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J3-06
filingDate 1993-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4771d795cca577d406f68dc74966ed9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a844dd3e5185774185eed5e7e59270d
publicationDate 1995-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0789780-A
titleOfInvention Cubic boron nitride coating
abstract (57) [Abstract] [Purpose] An intermediate layer for inducing oriented growth of cubic boron nitride is interposed between a ceramic substrate and an outer layer made of cubic boron nitride to form a dense outer layer and to form an outer layer. Provided is a cubic boron nitride coating having improved adhesion to a substrate. [Structure] Surface Al, Ga, I of ceramic substrate An intermediate layer composed of one or more nitrogen-containing compound layers selected from n, Tl nitrides, nitric oxides, and mutual solid solutions thereof is formed, and cubic boron nitride is the main component on the surface of the intermediate layer. A cubic boron nitride coating with an outer layer formed. [Effect] Excellent adhesion and peeling resistance between the outer layer and the intermediate layer, the intermediate layer and the substrate, and the intermediate layer, and high hardness, high thermal conductivity, wear resistance, oxidation resistance and chemical stability. .
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9738057-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022059952-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000294698-A
priorityDate 1993-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 25.