| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4826
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate |
1993-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1512e632b2dd75442d3e4f65473c85eb |
| publicationDate |
1995-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H0778840-A |
| titleOfInvention |
Resin-sealed semiconductor device |
| abstract |
(57) [Summary] (Modified) [Constitution] A polyimide-based resin coating layer having a specific structure is provided on the circuit element forming surface of the semiconductor chip 2, and the coating layer is used as the adhesive 1 to form a plurality of inner leads. Is bonded to the semiconductor chip, the inner lead and the semiconductor chip are connected by a bonding wire 4, and a resin-on-chip semiconductor device having a Lead On Chip structure sealed with a sealing resin. [Effect] Adhesion between the chip and the lead frame is possible at low temperature, and the number of work steps can be shortened. It is possible to prevent the absorbed moisture from vaporizing and expanding in the package at the time of solder reflow, so that it is possible to prevent the occurrence of package cracks. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10270611-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2013039029-A1 |
| priorityDate |
1992-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |