| abstract |
(57) [Summary] [Purpose] Not only is it excellent in conductivity and migration resistance, but it also has sufficient oxidation resistance even when left in high temperature and high humidity air, has excellent dispersibility, and is suitable for fine line circuits and Provide a conductive powder and a conductive paste that can sufficiently correspond to a fine pitch electrode. [Structure] General formula Ag X Cu 1-X (where 0.001 ≦ X ≦ 0.4, X is an atomic ratio, and a conductive paste used together with a conductive powder and an organic binder having the following structures (1) and (2). (1) The silver concentration on the grain surface is higher than the average silver concentration, and there is a region near the surface where the silver concentration increases toward the surface. (2) The particles contain 0.1 to 10,000 ppm of at least one component selected from Ti and Si components. |