http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0770316-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07C261-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 1993-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d983894527b61ee5ce8b1b3026cd67ba http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81552b5005a27c78043295776ead13e5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_545ab069a1d0b17807b024864a9ba908 |
| publicationDate | 1995-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0770316-A |
| titleOfInvention | Thermosetting resin composition for semiconductor encapsulation |
| abstract | (57) [Summary] [Structure] The resin component is a bismaleimide compound represented by the general formula (1) and / or its prepolymer (a), a polyfunctional cyanate having at least two or more cyanate ester groups in the molecule. A thermosetting resin composition for semiconductor encapsulation, which comprises an ester compound and / or its prepolymer (b) and the weight ratio of (a) and (b) is in the range of 99/1 to 30/70. [Chemical 1] (R 1 to R 8 represent hydrogen or an alkyl group, and they may be the same or different, and R 9 is Alternatively, when it is a divalent aliphatic residue and is a divalent aliphatic residue, the total number of carbon atoms of R 1 to R 9 is 3 or more and 7 or less. [Effect] It is possible to obtain an excellent resin composition having excellent toughness, adhesiveness, low water absorption, solder crack resistance, and flame retardancy, which is extremely reliable as a semiconductor encapsulating material. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008141052-A |
| priorityDate | 1993-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 88.