| abstract |
(57) [Abstract] [Purpose] Excellent photo-curability, heat-curability, developability in dilute aqueous alkali solution, adhesion, hardness, solvent resistance, acid resistance, electrical characteristics, heat resistance, plating resistance, etc. To obtain a solder resist film with excellent properties. [Structure] (A) 45 to 160 mg KO obtained by reacting a reaction product of a novolac type epoxy compound and an unsaturated monocarboxylic acid with a saturated or unsaturated polybasic acid anhydride An active energy ray curable resin having an acid value of H / g, Photocuring developable with a dilute alkaline solution containing a thermosetting component (B) photopolymerization initiator, (C) diluent and (D) epoxy compound having two or more epoxy groups in one molecule Liquid and thermosetting liquid resist ink composition is applied to a printed wiring board, and is selectively exposed to active energy rays through a resist pattern film having a predetermined pattern to be photocured. To develop a resist pattern, and then heat to heat cure. |