http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0739569-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate | 1990-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1995-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0739569-B2 |
| titleOfInvention | Base adhesive for electroless plating, printed circuit board using the adhesive and method for producing the same |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4600640-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005139387-A |
| priorityDate | 1989-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 64.