| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6fa19d21bf31fe2e6297bcc158e7acc3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-07811
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4691
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-148
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-361
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
1993-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3474a9fcf21518bdeb3566edbff8e144 |
| publicationDate |
1995-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H0738222-A |
| titleOfInvention |
Rigid-flexible circuit board and manufacturing method thereof |
| abstract |
(57) [Summary] [Purpose] A multi-layered type of rigid connection between conductive layers- A flexible circuit board is provided. The multilayer rigid-flexible circuit board has at least one rigid circuit board electrically connected to at least one flexible jumper. The conductive layer of each rigid circuit board is electrically and mechanically connected to the conductive layer of the flexible jumper via an adhesive layer. The adhesive layer is It consists of deformable conductive metal particles that are evenly dispersed in a non-conductive adhesive. The circuit board thus configured has a highly reliable heat resistance and can withstand mechanical strain, thermal cycling, typical circuit board fabrication, finishing, and assembly processes. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7378596-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7655869-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2005122657-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005122657-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7423219-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5006035-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111698842-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111698842-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100854614-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8093502-B2 |
| priorityDate |
1993-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |