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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-02
filingDate 1993-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ee0f48a18fff57587a3149533d4025d
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publicationDate 1995-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0734220-A
titleOfInvention Method of forming vapor deposition film
abstract (57) [Abstract] [Purpose] In a method of forming a vapor deposition film of an inorganic material such as a metal or a metal oxide on a resin substrate or a resin layer by vapor deposition, a vapor deposition film of an inorganic material having sufficient adhesion is provided. A forming method is provided. [Structure] A substrate is coated with a resin composition containing an ionizing radiation curable resin to form an intermediate resin coating film, the coating film is semi-cured, and the intermediate resin coating film in the semi-cured state is formed. Then, an inorganic material is vapor-deposited to form a vapor-deposited film, and then ionizing radiation is applied to completely cure the semi-cured coating film. The obtained vapor deposition film has sufficient adhesiveness, and peeling of the vapor deposition film is prevented.
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priorityDate 1993-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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