| abstract |
(57) [Summary] (Modified) [Purpose] To improve the hygroscopicity of 1,8-diazabicyclo (4.5.0) undecene-7, (DBU). When DBU is applied as a curing accelerator for a semiconductor encapsulating resin, the resin is prevented from being cured during storage and deterioration in the heating and kneading step. A curing accelerator for an epoxy resin comprising a molecular compound comprising DBU and a carboxylic acid compound represented by the following general formula (1) or (2) such as cholic acid, chloro or nitrobenzoic acid. |