| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9e1bf06f55de84b78abc9a057807f7eb |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-36 |
| filingDate |
1993-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6c495a4fb3c8285dc8a33a8531d41d6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62e2cb6817b4b0926faf6684d43d9a4f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42b5d8a697fc773a6ccd9a19c7976b29 |
| publicationDate |
1995-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H073150-A |
| titleOfInvention |
Polyamide composition |
| abstract |
(57) [Abstract] [Purpose] In a polyamide composition containing a copper compound as a heat stabilizer, deposition of metallic copper is suppressed during melt molding, and moldability is improved. [Constitution] N-substituted thiourea compound is added to the polyamide together with the copper compound in an amount of 0.001% by weight or more based on the polyamide. A composition containing less than 01% by weight. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11136447-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018092686-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018092686-A1 |
| priorityDate |
1993-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |