http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07311107-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7f42544f6b8a2c962c3b35d4bb3542bd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-84 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L9-04 |
| filingDate | 1994-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54461db8082cf289ba508ef2aded4f84 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3733b0101ef10e745b92e4a57af818ba |
| publicationDate | 1995-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H07311107-A |
| titleOfInvention | Sensor chip mounting method for pressure sensor |
| abstract | (57) [Summary] [Purpose] To make it possible to easily remove the sensor chip even in the mounted state. [Structure] A semiconductor sensor chip 2 for pressure measurement is mounted on a mounting substrate 5 with a wax material 6. At this time, (A) In the heating step, the mounting portion 5a of the mounting substrate 5 is heated to about 135 ° C., which is higher than the softening point temperature of the wax material 6. (B) In the applying step, the wax material 6 is applied to the mounting portion 5a. (C) In the bonding step, the sensor chip 2 is placed on the mounting portion 5a and its four corners are lightly pressed. In the cooling step, the material is gradually cooled in this state. In the bonded state, the sensor chip 2 can be held without being distorted without giving a strong bonded state, and moreover, it can be easily detached from the mounting substrate 5 if necessary by performing a predetermined process. It has excellent usability. |
| priorityDate | 1994-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.