http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H073109-A

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filingDate 1993-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fdfceb03b031984cf034b04791659bde
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publicationDate 1995-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H073109-A
titleOfInvention Polyamide resin composition and laminate using the same
abstract (57) [Summary] [Structure] (A) 40 to 98% by weight of a linear aliphatic nylon copolymer having a melting point of 130 ° C. or lower and (B) a polyolefin resin containing ethylene as a main constituent α, β A polyamide resin composition comprising 2 to 60% by weight of a modified polyolefin resin grafted with an unsaturated carboxylic acid or a derivative thereof, and a polyamide resin laminate using the same. [Effect] The composition is excellent in thermal adhesiveness and coextrusion moldability with a nylon resin for a film, and can maintain stable mechanical physical properties. Therefore, the nylon laminate using it as the outermost layer is preferably used for thermal bonding with a non-woven fabric or the like.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100752354-B1
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type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 24.