http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07309670-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B35-638 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 1994-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_233bb3192a32691acf2ff9f4ebb3fbb7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79f20656a68ae44df9da14ab6f2579a9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1c36bcf936f3aaa0bee708426d7e563 |
| publicationDate | 1995-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H07309670-A |
| titleOfInvention | Ceramic firing method and ceramic multilayer circuit board production method |
| abstract | (57) [Summary] [Structure] In the ceramics manufacturing process, 100 parts by weight of ceramic powder is used as a binder resin. Preparation of a green sheet containing 5 to 20 parts by weight of a polymer containing graded carbon, the green sheet prepared above is held at a binder resin depolymerization temperature of 600 ° C or less in a non-oxidizing atmosphere for a certain period of time to depolymerize the binder. The method for firing ceramics comprises the steps of decomposing into a monomer, scattering and removing it, and raising the temperature to the temperature of firing the ceramics for sintering. [Effect] The binder removal process that suppresses side reactions enables complete removal of the binder in an inert atmosphere at a temperature below the sintering start temperature of the glass ceramics, and at the same time, low melting point low-resistance metals such as copper and silver are removed. Can be used. As a result, it is possible to reduce the dielectric constant of the ceramics substrate and reduce the wiring resistance of the substrate. When it is used for a large-scale module substrate, it is possible to increase the size of the substrate by reducing the wiring resistance. The calculation speed can be improved by lowering the dielectric constant of the insulating layer. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014076914-A |
| priorityDate | 1994-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 48.