http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07307555-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ba54aff29064e18f1e36be0d4d17be67 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1163 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-405 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-50 |
| filingDate | 1994-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3930d32d2cd217f550bcdc18fed10ba9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42e453a8e8f7c78ad5758818807b7c83 |
| publicationDate | 1995-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H07307555-A |
| titleOfInvention | Printed circuit suitable for soldering and manufacturing method thereof |
| abstract | (57) [Abstract] [Purpose] It can be applied by using the dry or liquid resist method, can be processed by using an aqueous solution, and can prevent corrosion of the conductor mechanism covering it well, Prepare a solder resist screen with a surface that has low thread buildup. A printed circuit in which an image area is covered with a solder resist screen, and the surface of the solder resist screen is modified with an organic silyl compound. Preferably the silyl compound is a silazane and a solder resist screen covers the surface of the printed circuit except the soldering lands. Furthermore, a method for manufacturing a printed circuit for soldering is provided, and a printed circuit having a conductor mechanism is formed on a board made of an insulating material. The circuit is covered with a solder resist screen except for the soldering lands, and the surface of the solder resist screen is treated with a silylating agent. |
| priorityDate | 1993-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 77.