http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07302822-A

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filingDate 1995-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd60c27092b145113028b71d1e5617a4
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publicationDate 1995-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H07302822-A
titleOfInvention Ultrasonic welded plastic support ring for semiconductor devices
abstract (57) [Abstract] [Purpose] To provide a method for manufacturing a semiconductor device free from the influence of thermal expansion that causes bending of a lead frame lead wire. The method of manufacturing a semiconductor device comprises the steps of bonding the encapsulated semiconductor device to a lead frame, including a support ring made of a material that softens when ultrasonic energy is applied, Positioning the leads of the lead frame over a support ring, and embedding the leads in the support ring by applying ultrasonic energy to the support ring.
priorityDate 1994-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 23.