| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5c1a0c3cbdfa7fb2ffba0b359448fb77 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-20 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate |
1994-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a8a488f7b84347d8116d996122ee807
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9f68388fa54e1932cdd2b05591671b8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b38fb615c1e558e543cdb32333d7bf8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa92c4e645cc80d6c2c074957384462e |
| publicationDate |
1995-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H07300577-A |
| titleOfInvention |
Adhesive composition for flexible printed circuit board |
| abstract |
(57) [Summary] [Purpose] A flexible flame-retardant adhesive for printed circuit boards, which has excellent flame retardancy (UL 94-Vo), heat resistance, adhesiveness and flexibility. To provide an adhesive composition for a flexible printed circuit board. An acrylic copolymer polymerized with 10 to 45% by weight of acrylonitrile, 40 to 70% by weight of an alkyl acrylate having 8 or less carbon atoms, and 3 to 15% by weight of an olefin compound having at least one functional group capable of reacting with epoxy. 100 to 100% by weight of polymerized resin (based on solid content) 10 to 30% by weight of a polyfunctional epoxy resin having an epoxy equivalent of 300 and 20 to 90% by weight of a brominated epoxy resin having an epoxy equivalent of 200 to 900 and a bromine content of 30 to 70% by weight. It is a mixed adhesive composition for flexible printed circuit boards. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006213848-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10294341-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007039602-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005290171-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010523749-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018518563-A |
| priorityDate |
1993-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |