| abstract |
(57) [Summary] [Purpose] In an electronic device in which a semiconductor chip or the like is mounted on a substrate and the chip or the like is connected to the substrate by wire bonding, if the chip or the like is defective, Remove this and mount a new chip securely. [Structure] The wire 30 is cut at its neck portion 31 to remove the chip 20 from the substrate 10 (). The wire residue 32 remaining on the board-side pad 11 is processed so that its upper surface becomes flat (), and the surfaces of the wire residue 33 and the board-side pad 11 are irradiated with a laser 41 to clean them (). After that, a new chip is fixed on the substrate 10, and the pad of this chip and the substrate-side pad 11 on which the flattened wire residue 33 remains are connected by a new wire. |