| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-182
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-368 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate |
1994-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c979eb7385c9cec24764a16d3497a2d |
| publicationDate |
1995-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H07283335-A |
| titleOfInvention |
Semiconductor mounting board |
| abstract |
(57) [Summary] [Purpose] While enabling high integration of electronic components, An object of the present invention is to provide a chip-in-board type semiconductor mounting board which is easier to assemble and mount, and therefore has excellent manufacturability and excellent connection reliability. In a semiconductor mounting substrate having electronic components mounted on or in a plurality of laminated substrates, a recess is provided on an inner side surface of at least one of the substrates to be overlaid, and the electronic component is provided via the recess. Is a semiconductor-mounting substrate characterized in that the stacked substrates are face-bonded to each other by solder bumps, and the solder bumps are Sn thin film layers and at least a part of Sn crystal grains are Pb. Formed with a Sn-Pb coated crystal that is coated, It is desirable to form an alloy layer by cooling after heating and melting. As a result, it is possible to provide a chip-in-board type semiconductor mounting substrate which is excellent in connection reliability and manufacturability and has a high degree of integration. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001267492-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113038703-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010056355-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6948944-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0774888-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6324067-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8422241-B2 |
| priorityDate |
1994-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |