| abstract |
(57) [Abstract] [PROBLEMS] To provide a connecting device having a contact terminal capable of contacting an inspection object at multiple points and at high density, and a method for manufacturing the same. [Structure] A hole serving as a mold for forming the contact terminal 103 is formed by anisotropic etching of a silicon wafer, and the contact terminal 103, an insulating film 104 made of a polyimide film, and a lead wire are formed by using this mold. 105 To form. Further, the insulating film 104 and the wiring board 1 07 and the silicon wafer to be the buffer layer 108 and the substrate 109 are sandwiched and integrated, and the mold is removed. After that, the lead-out wiring 105 is connected to the electrode 110 a of the wiring board 107 with the solder 111. |