| abstract |
(57) [Summary] [Purpose] Used as a material for electrical and electronic parts, (EN) Provided is a palladium plating solution capable of obtaining a highly pure and stable palladium deposit excellent in solder wettability, heat resistance, bondability and the like. [Structure] Soluble palladium salt in an amount of palladium of 1.0 to 40.0 g / l, pyridinesulfonic acid or a salt thereof and / or pyridinecarboxylic acid or a salt of 0.1 to 20.0 g / l, a fluorosurfactant 1.0 ~ A palladium plating solution containing 20.0 ppm. |