http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07273157-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
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filingDate 1994-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ba01a9aa021562c387e052512482ea1
publicationDate 1995-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H07273157-A
titleOfInvention Semiconductor device inspection apparatus and semiconductor device inspection method
abstract (57) [Summary] (Correction) [Objective] To provide a semiconductor device inspection technique capable of highly accurately testing the electrical characteristics of a semiconductor device without damaging the semiconductor device. [Structure] Tester 15 for measuring electrical characteristics of a semiconductor device A wafer chuck 7 for mounting the semiconductor wafer 5C and heating or cooling the semiconductor wafer 5C, and pressing the electrode pads of the individual semiconductor chips formed on the semiconductor wafer 5C by connecting the tester 15 and the semiconductor chip to each other. And a probe card having a probe needle 6a for achieving electrical continuity of the semiconductor device, wherein the atmosphere of a portion where the electrode pad and the probe needle 6 contact each other is made to be a non-oxidizing atmosphere. The non-oxidizing gas supply means for supplying the inert gas or the reducing gas and the nozzle 9 are provided.
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priorityDate 1994-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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