http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07268075-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_097405822d505467fd50f7100022cd56 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate | 1994-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_558aec49e07d7d96a1778b2ae884e3cd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89a49ec4760731a9c316c51679b55920 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e993d7887ed02acd581d436f783c4e4b |
| publicationDate | 1995-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H07268075-A |
| titleOfInvention | Thermosetting resin composition |
| abstract | (57) [Abstract] [Purpose] Epoxy resin hardener is not contained, molding is easy, water is not generated as a by-product during curing, heat aging resistance is high due to curing, chemical stability and mechanical Provided is a polymaleimide thermosetting resin composition capable of obtaining a cured resin product having excellent physical properties. A thermosetting resin composition containing no epoxy resin curing agent and 0.5 to 60% by weight of component (c) and component (d). (A) Polymaleimide compound (b) Alkenylphenol compound having at least two alkenyl groups in one molecule and / or alkenylphenyl ether compound (c) Epoxy resin having at least two epoxy groups in one molecule |
| priorityDate | 1994-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 283.