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filingDate 1994-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c59eb193a384ad8472e03c7f6981bf82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65bb10d41acb2cad906695cda28e0718
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publicationDate 1995-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H07263816-A
titleOfInvention Semiconductor device and manufacturing method thereof
abstract (57) [Summary] [Object] To provide a semiconductor device and a method for manufacturing the same that enable ohmic contact between a p-type layer made of a II-VI group compound semiconductor epitaxial crystal and an electrode. [Structure] Nitrogen is added at a concentration of 1 × 10 16 between a p-type layer made of a II-VI compound semiconductor epitaxial crystal and an electrode layer. cm −3 to 1 × 10 19 cm −3 , and carbon 1 × 10 By interposing a highly doped p-type ohmic layer containing 15 cm −3 to 1 × 10 19 cm −3, a large tunnel current can be expected due to carbon contained in the crystal within this range. An ohmic contact is obtained in between. Further, by forming the p-type ohmic layer with the same crystal as that of the p-type layer, the lattice matching can be established between the original p-type layer and the p-type ohmic layer, so that no crystal defect occurs. . From the above, a semiconductor device having good electrical characteristics and high reliability can be manufactured with high yield.
priorityDate 1994-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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