http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0726183-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5784da447baef0515ed05f06a86bf01e |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-10 |
| filingDate | 1993-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d64da506b9b514ec1880377b218dafce http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d17bc99e014c16ae8d1fdd9e72b7db54 |
| publicationDate | 1995-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0726183-A |
| titleOfInvention | Composition for solder resist ink |
| abstract | (57) [Summary] [Structure] (A) General formula [Chemical formula 1] (R is H or CH 3, A is 6-oxabicyclo [3.1. 0] hexyl group, 7-oxabicyclo [4.1.0] heptyl group or 8-oxabicyclo [5.1.0] octyl group, n is 0 to 2), (B) novolak Energy curable resin derived from epoxy type epoxy compound, (C) photopolymerization initiator and (D) photocurable and thermosetting composition for solder resist ink developable by dilute alkaline solution Is. [Effect] It is excellent in photo-curing property, thermosetting property, heat resistance, water resistance, insulation property, solvent resistance, acid resistance and the like, and is suitably used for manufacturing consumer and industrial printed wiring boards and the like. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2004109402-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003041158-A |
| priorityDate | 1993-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 56.