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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-20
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filingDate 1993-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b0ce50e81321e7701a968a64a3970b2
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publicationDate 1995-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0726136-A
titleOfInvention Heat-stabilized polyphenylene ether / polyamide resin composition
abstract (57) [Abstract] [Purpose] Molded product appearance, mechanical properties, heat resistance, dimensional accuracy, fluidity during molding, solvent resistance and oil resistance without deteriorating heat stability during molding, high temperature atmosphere To provide a resin composition having extremely excellent heat deterioration resistance when used. [Constitution] (A) Polyphenylene ether resin 20-8 0 parts by weight, (B) 80 to 20 parts by weight of polyamide, (C) 0.1 to 10 parts by weight of a compatibilizer, 0.05 to 3 parts by weight of (D) N, N'-hexamethylenebis (3,5-di-t-butyl-4-hydroxy-hydrocinnamide), and (E) Tetrakis (2.4-ditertiarybutylphenyl) -4.4'-biphenylenediphosphonite 0.05 ~ 3 parts by weight of a resin composition.
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