| abstract |
(57) [Summary] (Modified) [Structure] (A) Epoxy resin having two or more epoxy groups in one molecule, (B) Phenolic resin having two or more phenolic hydroxyl groups in one molecule, ( C) an inorganic filler, and (D) (a) an organopolysiloxane represented by the following general formula (1), R 1 a R 2 b SiO (4-ab) / 2 (1) (wherein R 1 is a monovalent organic group having a radical-reactive group or an SH group.) (B) A (meth) acrylic acid ester represented by the following general formula (2), or a monomer copolymerizable therewith An epoxy resin composition comprising a mixture of a polymer and a silicon-containing acrylic polymer obtained by graft-polymerizing CH 2 ═C (R 3 ) —COOR 4 (2). [Effect] Good flexural modulus, low expansion coefficient, low stress, excellent crack resistance and adhesiveness, In addition, it is possible to provide a cured product having a small amount of deformation of the aluminum electrode and excellent moisture resistance. |