http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07258386-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate | 1994-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d70ab8ad20ce2e3455ea786b12c6e3f6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f8e8597b3499db68a000482a47314c52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a248e9ac1fda821c61ad943941740c5d |
| publicationDate | 1995-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H07258386-A |
| titleOfInvention | Epoxy resin composition for encapsulation and semiconductor device using the same |
| abstract | (57) [Abstract] [Purpose] Epoxy resin composition for encapsulation, which can obtain a semiconductor device having a low moisture absorption rate, good moisture absorption solder cracking property and moisture resistance reliability, and moisture absorption solder cracking property and moisture resistance using the composition. A semiconductor device having improved reliability is provided. A sealing epoxy resin composition obtained by adding a curing agent, a filler and a curing accelerator to an epoxy resin, the epoxy resin having a dicyclopentadiene skeleton and a naphthol resin curing agent. In addition, a semiconductor device is obtained by sealing a semiconductor element using the above sealing epoxy resin composition. |
| priorityDate | 1994-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.