http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0724955-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3f548ca15b9b5748f1afd80e3d1636ec |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate | 1993-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97b0ac399503b741a79cf6c720d49d0a |
| publicationDate | 1995-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0724955-A |
| titleOfInvention | Copper clad laminate |
| abstract | (57) [Summary] [Structure] The present invention is a copper-clad in which a glass base material is laminated with a plurality of prepregs impregnated with an epoxy resin composition and dried, and at least one surface of the prepreg is overlaid with a copper foil to be integrally molded. In the laminated plate, the surface layer of the substrate, characterized in that using a prepreg impregnated and dried epoxy resin composition containing a silane coupling agent and an inorganic filler 10 to 50 wt% in a glass substrate, It is a copper clad laminate. [Effect] The copper-clad laminate of the present invention has excellent tracking resistance, and also maintains other electrical, mechanical, heat resistance, and humidity resistance in a well-balanced manner like conventional products. It is suitable for use. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007245548-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101222097-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9735457-A1 |
| priorityDate | 1993-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 38.