http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07245468-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_663cad2cddb9415ae5ba8d9c99803cda |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
filingDate | 1994-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0c3997dbd3d889d49e9053532059730 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9de273fecfa19bad58897fdf4ecb1d64 |
publicationDate | 1995-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-H07245468-A |
titleOfInvention | Method for manufacturing printed wiring board |
abstract | (57) [Abstract] [PROBLEMS] To provide a method for manufacturing a printed wiring board having a high resolution and a fine circuit pattern with few defects. [Structure] After forming an electroless plating catalyst layer on an electrically insulating substrate, a photoconductive layer containing at least a photoconductive compound is provided, and a toner image is formed on the photoconductive layer by an electrophotographic method. The photoconductive layer other than the image part is dissolved and removed, and the remaining photoconductive layer is used as a plating resist to form a metal wiring pattern on the electrically insulating substrate other than the plating resist part by a plating method. Production method. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7670742-B2 |
priorityDate | 1994-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 63.