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filingDate 1994-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77ef3f19ee5a5c6539aeb536ef9461b9
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publicationDate 1995-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H07242732-A
titleOfInvention Epoxy resin composition for molding, molded product for high voltage equipment using the same, and method for producing the same
abstract (57) [Abstract] [Purpose] A resin composition having excellent mechanical properties such as high mechanical strength and high toughness and excellent heat resistance, and a method for producing a molded product using the resin composition and the method for producing the same. It has excellent crack resistance, To provide molded products with high reliability. [Structure] Epoxy resin composition for molding comprising an epoxy resin (A), an acid anhydride (B), a curing accelerator (C), a coupling agent (D) and a filler (E), and the molding. A process for producing a molded product for a high-voltage device using the epoxy resin composition for a high-voltage device, and a molded product for a high-voltage device obtained by the process.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013233805-A
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