http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07238123-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c8d4dc7bd1a30d8fda907fceaeb4e69 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F222-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F22-36 |
| filingDate | 1994-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1dfbf8b0c26a42a0f3f03594f192c38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9cec4122305fe70f369683bfb45b4afa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7038b113df95f747ac8284946a1ac07e |
| publicationDate | 1995-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H07238123-A |
| titleOfInvention | Resin composition for semiconductor encapsulation |
| abstract | (57) [Summary] [Purpose] It contains a maleimide resin with excellent heat resistance as a resin component, has good fluidity during molding, has low hygroscopicity, and has excellent mechanical properties such as bending strength. Provided is a highly reliable resin composition for semiconductor encapsulation, which allows a cured molded product to be obtained. [Structure] Polymaleimide compound (A) containing bismaleimide represented by a specific structural formula 5 to 20% by weight, allylphenol compound (B) having 2 or more allyl groups in the molecule 4 to 15% by weight %, Silica particles (C) 25-9 0% by weight, and peroxyketal compound (D) 0. A resin composition for semiconductor encapsulation, comprising 1 to 5% by weight, respectively. |
| priorityDate | 1994-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 81.