| abstract |
(57) [Summary] [Structure] A dicarboxylic acid component in which 60 to 100 mol% of the dicarboxylic acid component is terephthalic acid, and a diamine component in which 60 to 100 mol% of the diamine component is 1,9-nonanediamine, A hot melt adhesive containing a polyamide having an [η] of 0.3 to 2.0 dl / g measured in concentrated sulfuric acid at 30 ° C. [Effect] The polyamide hot melt adhesive of the present invention has remarkably improved chemical resistance, water resistance, calcium chloride resistance, heat resistance, and light weight as compared with conventional polyamide hot melt adhesives. And adhesiveness, strength, and toughness. |