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filingDate 1993-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91214bc97d297d183c231807ec2223a3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2da947395ec889630de74803b71dfbfa
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publicationDate 1995-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0722320-A
titleOfInvention Method for manufacturing semiconductor device
abstract (57) [Summary] [Objective] By treating the surface of the substrate with an organic compound to absorb the molecules of the organic compound and make the activity of the surface constant, the surface dependence of the substrate base is eliminated, and the deposition rate To improve the morphology of the substrate surface and improve its uniformity. When a semiconductor device is manufactured, in chemical vapor deposition of a metal, the surface of the substrate 1 is surface-treated with an organic compound or a solution thereof before the vapor phase growth to uniformly form a film, and to obtain a morphology. To reduce the fluctuation of.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021220696-A1
priorityDate 1993-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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