http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07211752-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_35daf87331a5b8220b5772e5230a6385
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073
filingDate 1994-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a855abad4e7608c15aa7a6b854460cb7
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publicationDate 1995-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H07211752-A
titleOfInvention Electronic circuit probe
abstract (57) [Abstract] [Purpose] To provide a probe that can sufficiently support product testing of highly integrated electronic circuits. A comb piece 3 is formed by cutting slits 3'on one side of a thin plate 2 of a flexible insulating material at a pitch corresponding to the arrangement pitch of object terminals. Next, the measurement terminal 4 is provided at the tip of each comb piece 3, and the measurement terminal 4 is provided with an arbitrary position on the thin plate 2, for example, a connector electrode 6 provided at a position opposite to the measurement terminal 4. Further, a lead 5 for connecting the measurement terminal 4 and the connector electrode 6 is formed by conductor patterning by photolithography.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0860702-A3
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013084568-A
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priorityDate 1994-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 30.