http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07207120-A

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filingDate 1994-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df240c1bf5a7a1a215cc2daee70416bc
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publicationDate 1995-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H07207120-A
titleOfInvention Phenolic resin composition with excellent heat resistance
abstract (57) [Summary] [Structure] 100 parts by weight of a phenol resin having benzene, phenol and a polycyclic aromatic group as a skeleton, 50 to 100 parts by weight of a resol resin, and 1 part of hexamethylenetetramine. 0 to 50 parts by weight of the composition, or 100 parts by weight of a phenol resin having benzene, phenol and polycyclic aromatic skeleton, and polyvinylphenol 50 to 1 50 parts by weight, resol resin 50 to 100 parts by weight, and hexamethylenetetramine 20 to 80 parts by weight, or preferably 1 to 3 parts by weight of an antioxidant with respect to 100 parts by weight of the composition. Parts, and a heat-resistant phenolic resin molding material obtained by mixing glass fibers and other inorganic fillers with these compositions. [Effect] The obtained molded product has excellent heat resistance and little thermal deterioration, and the curability and mechanical strength are equal to or higher than those of the conventional phenol resin composition or the molding material. It is extremely suitable for making various metal parts such as resin.
priorityDate 1993-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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