http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07205382-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
filingDate 1994-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65e39db73681ae70c0c3ab7c1b65cbb8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_349d4f6273d246e89848148a0b221d95
publicationDate 1995-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H07205382-A
titleOfInvention Heat-fusible film and film-like circuit laminate
abstract (57) [Summary] [Structure] A laminated film comprising a wholly aromatic aramid film having an average coefficient of linear thermal expansion in the width direction at 20 to 300 ° C. of 8 ppm or less, on one side or both sides of which a thermoplastic resin is arranged as a fusion agent, And a laminate having a metal foil layer formed in a circuit shape on one side or both sides of this laminated film. [Effect] When mounting a semiconductor or other electric circuit (for example, used for FPC, lead frame reinforcing tape, TAB carrier tape, die bonding tape), the processing time can be shortened and the processing process can be simplified. Further, the obtained product can be a fine pitch because a molded product having good dimensional stability can be obtained.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006312703-A
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priorityDate 1994-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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