Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13099 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03912 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03622 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05171 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0001 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-43 |
filingDate |
1994-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ffd66e4c5c472e9f1560baa0594f8c1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07a094670c0a24e2aba190785eaae9bc |
publicationDate |
1995-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-H07201871-A |
titleOfInvention |
Metal contact formation method |
abstract |
(57) [Abstract] [Purpose] A method for connecting an integrated circuit chip to a substrate is provided. A CrCu layer is blanket deposited onto a completed wafer with terminal vias etched into the insulator. PbSn solder dots are then formed by electroplating or vapor deposition. The copper layer is etched using the solder dots as a mask. Next, the solder dots are melted / re-solidified to form an oblate sphere or a ball. Further, a positive photoresist 16 is applied so as to be distributed around the bottoms of the solder balls. The solder balls are used as a self-aligned exposed mask. Since the photoresist 16 under the solder balls is not exposed, a photoresist protective ring is created in that area after development. This guard ring protects the copper-solder contact surface and is used as a mask when etching the chrome layer. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010126807-A |
priorityDate |
1993-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |