| abstract |
(57) [Abstract] [Purpose] The long-term heat aging resistance of polyamide resin has been greatly improved, the precipitation of metallic copper in the molding machine has been greatly reduced, and the appearance color change of the resulting molded product due to water absorption is extremely small. A resin composition is provided. [Structure] Polyamide resin, copper compound, iodine compound, A polyamide resin composition comprising a carboxylic acid compound and satisfying the following. (1) 1 ≦ copper concentration ≦ 200 ppm (2) 12 ≦ gram atom ratio of iodine to copper (I / Cu) ≦ 40 (3) 0.0 with respect to 100 parts by weight of the polyamide resin A polyamide resin composition comprising 1 part by weight or more and 0.5 parts by weight or less of an aliphatic carboxylic acid or a derivative thereof, (4) Carboxyl group concentration relative to the total amount of carboxyl group concentration and amino group concentration in the polyamide resin composition. A polyamide resin composition having a ratio of 50% or more. |