| abstract |
(57) [Abstract] [PROBLEMS] A thin film capacitor and a method for manufacturing the same, which can be used spatially efficiently, and which derives a capacitance due to a lead wire for electrical connection, and a conductive member that constitutes the capacitor. The purpose is to minimize the possibility of short circuits. A ground side and power side vias 16 and 17 are formed in a dielectric substrate 12, and a bottom contact layer 25 is provided on the front side of the substrate. Also, a bottom contact side power terminal 34 is formed in the bottom contact layer 25 and is separated from the remaining portion of the bottom contact layer by an insulating plug 33. An upper contact layer 45 is provided above the bottom contact layer via a dielectric layer 38. In addition, 50 and 60 are front side ground terminals and power terminals, respectively, and 62 and 64 are back side ground terminals and power terminals, respectively. |