| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_097405822d505467fd50f7100022cd56 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
1993-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85b9bc456cb06fd0a355dc957310fae0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_540bc7dfecf4c2881fa3b2dd98373916
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94435ab227f326190f3eeaf45b14b21a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6ddb2bdb7b8e73eab1d3125c4c7ab6f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1922bd8704772e28c10d259f062e91ca |
| publicationDate |
1995-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H07170073-A |
| titleOfInvention |
Method for manufacturing multilayer printed wiring board |
| abstract |
(57) [Summary] The present invention provides a panel for an inner layer, a layer of an alkali-soluble second resin composition having a large fluidity when heated, a layer of an alkali-soluble first resin composition and copper. The present invention relates to a method for producing a multilayer printed wiring board using a copper clad laminate panel in which layers of copper are laminated, wherein the layers of the first and second resin compositions are dried separately. . [Effect] It becomes possible to continuously manufacture a multilayer printed wiring board having a blind via hole of excellent quality by a hot roll without using a large-scale and expensive electron beam irradiation device. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6338936-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9717824-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0804061-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0804061-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6576409-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9716948-A1 |
| priorityDate |
1993-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |