http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07147307-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
| filingDate | 1993-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1aa44864ab977197e60220e8c1c03d4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_703019786fedd4f7d2ad6f26d7b2ea0d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65484a8d3454ca4254795532ced3f562 |
| publicationDate | 1995-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H07147307-A |
| titleOfInvention | Inspection equipment |
| abstract | (57) [Summary] [Object] To reduce a temperature difference generated in a plane of a semiconductor integrated circuit device when electrically inspecting the semiconductor integrated circuit device in a cooled state. [Structure] During electrical inspection of a semiconductor integrated circuit device, In the inspection device 1 that inspects the semiconductor chip 2 in a cooled state by spraying the cooling medium sprayed from the nozzle 9 onto the semiconductor chip 2, a plurality of nozzles 9 are provided and the inner diameter of the central nozzle 9c is set. , Smaller than the inner diameter of the surrounding nozzle 9. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20020061468-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014123411-A |
| priorityDate | 1993-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9397 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419573697 |
Total number of triples: 17.