http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07145227-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c8d4dc7bd1a30d8fda907fceaeb4e69 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-56 |
| filingDate | 1993-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6d323e8320c847035794bb5d61464ef http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0036fb7af03f575588f76bc93725bff8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bbbcedf34a6330b3cc474b18e03580e |
| publicationDate | 1995-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H07145227-A |
| titleOfInvention | Epoxy resin composition for casting and casting product of the same |
| abstract | (57) [Summary] (Modified) [Structure] (A) Low-viscosity epoxy resin containing trifunctional or tetrafunctional liquid epoxy resin and having a viscosity at 25 ° C. of 60 poise or less, and (b) cyan group Contains an imidazole-based epoxy resin curing agent containing an imidazole-based compound as a main component, (c) a liquid alicyclic diamine compound, and (d) a metal powder having an average particle size of 100 μm or less, Total amount of component (a), component (b) and component (c) 100 For casting in which the amount of component (d) is 200 parts by weight or more with respect to parts by weight and the amount of component (c) is 0.05 to 0.5 equivalents based on the epoxy groups of component (a). Epoxy resin composition. In addition, the amount of 50% by weight or less of the component (d) is (E) It can be replaced with an inorganic filler other than the metal powder having an average particle size smaller than that of the component (d). [Effect] Cured resin (cast product) that does not cause sedimentation and separation of metal powder or inorganic filler during curing, has a low temperature rise due to heat generation during curing, and has excellent heat resistance, impact resistance, and thermal shock resistance. And is particularly suitable for the production of resin molds. |
| priorityDate | 1993-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 53.