| abstract |
(57) [Summary] [Object] The present invention relates to a semiconductor device, and in particular, an object thereof is to improve heat dissipation and moisture resistance. [Structure] A plurality of solder balls 42 for mounting on the lower surface, A substrate 32 having a substrate 38, a semiconductor element 31 mounted on the substrate, a resin package portion 33 formed on the substrate and sealing the semiconductor element, and a resin package portion in close contact with the resin package portion. And a frame member 34 made of aluminum surrounding the substrate. |