http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07140676-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2686e1bcdae5fda150bc8977a1ba9f81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42 |
| filingDate | 1993-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_892dd7e1d4c766388d847533c6cd5bbc |
| publicationDate | 1995-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H07140676-A |
| titleOfInvention | Epoxy resin photo solder resist stripper |
| abstract | (57) [Abstract] [Purpose] Epoxy resin photo solder resist can be used to reduce the peeling time of the unexposed area and, when the exposure amount is increased, a highly sensitive epoxy resin photo solder resist was used. In some cases, or even after leaving for a long time after exposure, an epoxy resin-based photosolder resist remover capable of reliably removing an unexposed portion is provided with a simple structure. [Structure] A stripping solution for stripping unexposed portions of an epoxy resin photo solder resist, in which an additive of propylene glycol ether was added to an alkaline solution. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008542830-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190051965-A |
| priorityDate | 1993-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.