http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07138483-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c8d4dc7bd1a30d8fda907fceaeb4e69 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3415 |
| filingDate | 1993-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9cec4122305fe70f369683bfb45b4afa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7038b113df95f747ac8284946a1ac07e |
| publicationDate | 1995-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H07138483-A |
| titleOfInvention | Resin composition for semiconductor encapsulation |
| abstract | (57) [Summary] [Purpose] Using a maleimide resin with excellent heat resistance, A highly reliable resin for semiconductor encapsulation that has good flowability during molding, good relaxation of thermal stress, and excellent curing properties during molding and mechanical properties such as bending strength of the cured molded product. A composition is provided. [Structure] 2 to 20% by weight of a polymaleimide compound, 2 to 15% by weight of an allylphenol compound having two or more allyl groups in a molecule, and 0.5 to 10% by weight of a modified polyaminosiloxane compound represented by a specific structural formula. %, 25 to 95% by weight of silica particles, and 0.1 to 5% by weight of an organosilane compound represented by a specific structural formula. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003012938-A |
| priorityDate | 1993-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 66.